A four level silicon microstructure fabrication by DRIE
Journal article, 2016

We present a four level Si microstructure fabrication process with depths ranging from 70-400 μm. All four levels are etched from the same side, by using four hard masks (SiO2, Al, AZ4562 photo resist, and Al). The choice of the hard masks and their relative selectivity will be discussed. Also two different deep reactive ion etching (DRIE) processes, performed in two different machines, are compared and evaluated. The process evaluation and discussions are based on the vertical walls deviation from a right angle, the surface roughness and the resolution. In the end, a solution is proposed to remove spikes and grassing which appeared during both DRIE processes, and the impact of removing them from the surfaces is discussed.

MEMS

micromachining

DRIE

Author

Sofia Rahiminejad

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Piotr Cegielski

Chalmers, Microtechnology and Nanoscience (MC2)

Morteza Abbasi

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Journal of Microelectromechanical Systems

1057-7157 (ISSN)

Vol. 26 8 084003-

Areas of Advance

Information and Communication Technology

Nanoscience and Nanotechnology (2010-2017)

Transport

Production

Driving Forces

Innovation and entrepreneurship

Subject Categories

Communication Systems

Nano Technology

Infrastructure

Nanofabrication Laboratory

DOI

10.1088/0960-1317/26/8/084003

More information

Latest update

9/21/2018