Experimental measurements for mechanical and electrical conductive properties of CNT bundles
Paper in proceeding, 2013

With the miniaturization and multifunction trend in consumer electronics and other numerous applications, the characteristic sizes of chips, components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase constantly. Carbon nanotube (CNT) has become a promising material due to its mechanical and conductive properties. In this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

Mechanical behavior

Carbon nanotubes

Mechanical and electrical

Consumer electronics

Heat flux

Heat flux densities

Silicon chip

Electrical conductivity

Characteristic size


Conductive properties


Flip chip interconnects


Y. Zhang

Shanghai University

Yingjie Zhou

Shanghai University

Jing-yu Fan

Shanghai University

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013

9781605951096 (ISBN)

Subject Categories

Nano Technology

Bioinformatics and Systems Biology



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