High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper in proceedings, 2006

Author

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA

Subject Categories

Other Materials Engineering

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Created

10/7/2017