Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
Paper in proceeding, 2006


Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

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Other Materials Engineering

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