Power monitoring, Fourier transforms of power, and electron microscopy in evaluating the performance of abrasives in grinding
Journal article, 2016

The use of electron microscopy and power-monitoring during grinding was investigated in terms of evaluating the fracture and wear characteristics and chip-formation mechanisms of abrasive grains and bond formulations. Diamond abrasives and fused, sintered and sintered triangular-shaped aluminium-oxide abrasives were evaluated. Power was shown to be a useful tool in determining the chip-formation mechanisms and the extent of grit fracture, particularly in triangular-shaped abrasive. Conclusions were supported by electron-microscope analysis. Power was also used to evaluate low-cost diamond vs. premium diamond abrasives. Practical recommendations are given for evaluating grit, wheel and bond performance both in the laboratory and in production.

Electron microscopy

Sintered abrasive




Engineered-shape abrasive


J. Badger

International Grinding Institute

Grinding Doc Consulting

R. Drazumeric

University of Ljubljana

International Grinding Institute

Peter Krajnik

Chalmers, Materials and Manufacturing Technology, Manufacturing Technology

International Journal of Abrasive Technology

1752-2641 (ISSN) 1752-265X (eISSN)

Vol. 7 4 270-283

Subject Categories

Production Engineering, Human Work Science and Ergonomics

Areas of Advance




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9/6/2018 1