Fabrication process and 110 GHz measurement result of MS-to-CPW RF-via transition for RF-MEMS devices packaging applications
Paper in proceedings, 2009
Fabrication
Packaging
Microelectromechanical device
Microstrip
Millimeter-wave
Author
Li-Han Hsu
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Wei-Cheng Wu
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
E. Y. Chang
National Chiao Tung University Taiwan
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Y. C. Wu
National Chiao Tung University Taiwan
C. T. Wang
National Chiao Tung University Taiwan
S. P. Tsai
National Chiao Tung University Taiwan
2009 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2009
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
978-189358013-8