Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications
Paper in proceeding, 2004
Author
Junmei Duan
Johan Asplund
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4)
Vol. 04 EX905 pp 290-293
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering