Transmission Loss in Coplanar Waveguide and Planar Goubau Line between 0.75 THz and 1.1 THz
Paper in proceeding, 2018

In many cases, metallic planar waveguides are required in the design of integrated circuits. However, at terahertz frequencies, metallic planar waveguides present high losses, which make necessary the use more efficient waveguides to avoid power limitations. In this work, the attenuation constant of two popular planar waveguides for terahertz frequencies, Coplanar Waveguide (CPW) and Planar Goubau Line (PGL), are compared between 0.75 THz and 1.1 THz. To measure the PGL, its transition is deembeded using a multiline Thru-Reflect-Line calibration standard. Measurement results show a lower attenuation constant across the band for a PGL (0.13 mm-1 < α < 0.39 mm-1) than for a CPW (0.68 mm-1 < α < 0.99 mm-1) when an ultra-thin substrate is used suspended in air, which greatly reduces the substrate mode coupling from the PGL. These results put the PGL as a less lossy metallic planar waveguide for terahertz applications.

Coplanar waveguides

Calibration

Strips

Attenuation

Planar waveguides

Optical waveguides

Substrates

Author

Juan Cabello Sánchez

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Helena Rodilla

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Vladimir Drakinskiy

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Jan Stake

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz

21622027 (ISSN) 21622035 (eISSN)

1-2
978-153861395-5 (ISBN)

2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
Nagoya, Japan,

Areas of Advance

Information and Communication Technology

Infrastructure

Kollberg Laboratory

Nanofabrication Laboratory

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/IRMMW-THz.2018.8510326

More information

Latest update

3/21/2023