Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices

Paper in proceeding, 2018

Copper is generally considered as an electronic packaging material due to its good electrical, thermal properties and relatively low cost. However, copper needs high processing temperature, which negatively affects the electronics reliability. In this paper, silver nanoparticles sintering is evaluated for the propose to decrease the processing temperature of copper. Different fractions of silver nanoparticles were mixed with 10 ×m Cu powder and sintered at temperatures of 250°C, 300°C, 400°C and 500°C, under low pressures 4MPa and 8MPa, and a high pressure of 100MPa for comparison. Densities from 45% to 94% of the density of bulk Cu have been achieved while the thermal and electrical conductivities have been evaluated and reached a value of around 270W/m.K and 1.41×106 S/m.