Mechanical properties of a novel multi-scale silver paste for electronics interconnect application
Paper in proceeding, 2019
A novel nano-silver paste with characteristics of sintering at low temperature and operating at high temperature is one of the most promising interconnect materials in the semiconductor industry. This study focuses on the shear strength of sintered multi-scale silver paste synthesized by nano-silver particles, micro-silver particles and submicron silicon carbide particles coated with Ag (SCA). The silver paste was sintered at 250 °C without pressure. The shear strength reaches 9.22 MPa, with 64 wt.% nano-silver particles, 16.5 wt.% micro-silver particles and 1.5 wt.% SCA, respectively. With this, it shows great potential for high power electronics interconnect and cooing applications.
Electronics packaging
SCA particles
High power electronics
Temperature
Shear strength
Sintered carbides
Silver paste
Silicon carbide
Semiconductor device manufacture
Mechanical properties
Author
Yongqian Sun
Shanghai University
Xiuzhen Lu
Shanghai University
Q. Zhang
Shanghai University
Xiao Xin Zhang
Shanghai University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L. Ye
SHT Smart High-Tech
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
9081004
978-172815064-2 (ISBN)
20th International Conference on Electronic Packaging Technology, ICEPT 2019
Hong Kong, China,
Hong Kong, China,
Subject Categories
Ceramics
Materials Chemistry
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICEPT47577.2019.245310