Development and characterisation of nanofiber films with high adhesion
Paper in proceeding, 2011

With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronic packaging. This paper reports the study on fabrication of a nanofiber films used for nano-thermal interface material (nano-TIM) with the adhesive function. The nano-TIM with high thermal conductivity and low thermal resistivity has been fabricated by electrospinning process. In the present work, hotmelt was added into the electrospinning solution to improve the adhesion properties of the film. The morphology of the film was observed by Scanning Electrical Microscope (SEM). The nanofiber films have a nano-scale structure with hotmelt randomly attached into the fiber matrix. Shear tests were conducted to measure the bonding strength of nanofiber films. The results show that the nanofiber films reached a 6.52 MPa in terms of average shear strength, more than 2 times better than the case without the hotmelt addition. © 2011 IEEE.

Author

X. Tang

Shanghai University

H. Cui

Shanghai University

Xiuzhen Lu

Shanghai University

Q. Fan

Shanghai University

Zhichao Yuan

Shanghai University

L. Ye

Shanghai University

Johan Liu

SHT Smart High-Tech

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Shanghai University

Proceedings - Electronic Components and Technology Conference

05695503 (ISSN)

673-677 5898586

2011 61st Electronic Components and Technology Conference, ECTC 2011
, USA,

Areas of Advance

Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)

Materials Science

Subject Categories

Polymer Technologies

Textile, Rubber and Polymeric Materials

Composite Science and Engineering

DOI

10.1109/ECTC.2011.5898586

More information

Latest update

8/12/2021