High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Journal article, 2023

In this paper, a planar spiral resonator operating at 13 GHz is investigated. The resonator was fabricated using fan-out wafer level packaging (FoWLP) technology. The field analysis highlights the importance of via fence. Two thick film resistors suppress an undesired resonance in proximity of targeted one. The measurements demonstrate a very good correlation in comparison with full-wave simulations. The measured Q-factor defined based on analysis of feedback oscillatory system is about 48. The proposed configuration is suitable for voltage-controlled oscillators (VCOs) with a resonator realized in package.

Q-factor

Ku-band

fan-out wafer level packaging

resonator

VCO

Author

Mykola Chernobryvko

Fraunhofer Institute for Reliability and Microintegration - IZM

Michael P. Kaiser

Fraunhofer Institute for Reliability and Microintegration - IZM

Kavin Senthil Murugesan

Fraunhofer Institute for Reliability and Microintegration - IZM

Dan Kuylenstierna

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Julia Marie Koszegi

Fraunhofer Institute for Reliability and Microintegration - IZM

Robert Gernhardt

Fraunhofer Institute for Reliability and Microintegration - IZM

Tanja Braun

Fraunhofer Institute for Reliability and Microintegration - IZM

Ivan Ndip

Fraunhofer Institute for Reliability and Microintegration - IZM

Martin Schneider-Ramelow

Fraunhofer Institute for Reliability and Microintegration - IZM

Advancing Microelectronics

22228748 (ISSN)

Vol. 2023 Special issue EMPC 57-60

GaN mm-wave Radar Components Embedded (GRACE)

European Commission (EC) (EC/H2020/821270), 2018-11-01 -- 2020-10-31.

Subject Categories

Communication Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.23919/EMPC55870.2023.10418411

More information

Latest update

7/2/2024 5