Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Paper in proceedings, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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