Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution
Paper in proceeding, 2006

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of Micro Structure Workshop 2006

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/8/2017

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