Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications
Paper in proceedings, 2001

Author

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

209-212

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017