Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process
Paper in proceedings, 2001

Author

D. C. Whalley

G. Glinsky

C.J. Bailey

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the 3rd International Symposium on Electronics Materials and Packaging

393-398

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017