Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes
Paper in proceeding, 2002
Author
Liqiang Cao
Shiming Li
Johan Liu
Department of Microelectronics and Nanoscience
Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP)
272-277
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering