THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE

Liu Chen; Lisa Ekstrand; Johan Liu

THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE
Paper in proceeding, 2005

Author

Liu Chen

Lisa Ekstrand

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05)

224-227

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE Paper in proceeding, 2005