Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications
Book chapter, 2001
Author
Helge Kristiansen
Johan Liu
Department of Microelectronics and Nanoscience
Area Array Interconnection Handbook
0-7923-7919-5 (ISBN)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
0-7923-7919-5