Multi-Gigabit, Scalable & Energy Efficient on-board Digital Processors Employing Multi-core, Vertical, Embedded Opto-electronic Engines (MERLIN)
Forskningsprojekt , 2013 – 2016

New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disruptive solution must combine scalability, technical feasibility, power-efficiency and cost-effectiveness. MERLIN aims to provide this solution realizing multi-gigabit optical inter-connectivity with a unique combination of low-power and high-bandwidth multimode (MM) GaAs VCSEL/PDs, low power, radiation-hardened BiCMOS drivers and radiation-hardened multi-core fibers (MCFs). MERLIN will integrate these technologies on a space grade photonic integration capable to provide ruggedized transceiver modules with a record-high 150Gb/s throughput and 6mW/ Gb/s energy consumption which is a 3-fold improvement against state-of-the-art (SOTA) US-based products. MERLIN will fabricate the first >15GHz MCF-matched 850nm VCSELs operating at -40 to +100 oC and will drive energy consumption down to <200 fJ/bit (0.2 mW/Gb/s). MERLIN will demonstrate the first >30 GHz MM MCF-PDs with >0.6A/W responsivity. MERLIN will couple MCF-VCSELs/PDs to the first 6-core radiation-hard MM-MCF to offer the capability for single-feedthrough robust and hermetic module packaging. Fibers will be distributed through a monolithic fan-out avoiding the use and procurement of expensive connectors. MERLIN will develop the first 25 Gb/s 6-channel, driver/TIA ICs with record-low <2pJ/bit energy consumption in a 5-fold decrease against SOTA products. ICs will be fabricated with IHP 0.25µm SiGe BiCMOS process which is under ESA qualification. MERLIN will fabricate an opto-electronic 6x25 Gb/s capable ADC/DAC module using MCF optical interfaces and will test it in a full-scale optical interconnect breadboard demonstrator. Finally, MERLIN will perform space assessment tests on all the components to align development towards a European space qualifiable system.

Deltagare

Anders Larsson (kontakt)

Avdelningschef vid Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Samarbetspartners

Innovations for High Performance Microelectronics (IHP)

Frankfurt, Germany

OFS

Brøndby, Denmark

Philips Technologie

Hamburg, Germany

Teknologian Tutkimuskeskus (VTT)

Espoo, Finland

Thales Alenia Space France

Toulouse, France

Finansiering

Europeiska kommissionen (FP7)

Finansierar Chalmers deltagande under 2013–2016

Relaterade styrkeområden och infrastruktur

Informations- och kommunikationsteknik

Styrkeområden

Hållbar utveckling

Drivkrafter

Nanovetenskap och nanoteknik (2010-2017)

Styrkeområden

Nanotekniklaboratoriet

Infrastruktur

Mer information

Senast uppdaterat

2015-10-30