Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding
Artikel i vetenskaplig tidskrift, 2010

This paper presents initial results on generic characterization methods for wafer-level encapsulation. The methods, developed specifically to evaluate anodic bonding of low-temperature cofired ceramics (LTCC) to Si, are generally applicable to wafer-level encapsulation. Different microelectromechanical system (MEMS) structures positioned over the whole wafer provide local information about the bond quality. The structures include (i) resonating cantilevers as pressure sensors for bond hermeticity, (ii) resonating bridges as stress sensors for measuring the stress induced by the bonding and (iii) frames/mesas for pull tests. These MEMS structures have been designed, fabricated and characterized indicating that local information can easily be obtained. Buried electrodes to enable localized bonding have been implemented and their effectiveness is indicated from first results of the novel Si to LTCC anodic bonding.

Författare

M. F. Khan

Imego AB - The Institute of Micro and Nanotechnology

Chalmers University of Technology

Farzan Alavian Ghavanini

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

S. Haasl

Imego AB - The Institute of Micro and Nanotechnology

L. Lofgren

Imego AB - The Institute of Micro and Nanotechnology

K. Persson

Imego AB - The Institute of Micro and Nanotechnology

Cristina Rusu

Imego AB - The Institute of Micro and Nanotechnology

K. Schjolberg-Henriksen

SINTEF Digital

Peter Enoksson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Journal of Micromechanics and Microengineering

0960-1317 (ISSN)

Vol. 20 6

Styrkeområden

Transport

Produktion

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1088/0960-1317/20/6/064020