High frequency properties of electrically conductive adhesive interconnections and multilayer substrates
Licentiatavhandling, 1998

microwaves

sequential build-up board

electrically conductive adhesives

flip-chip

printed cirquit board

anisotropic adhesives

multilayer

interconnections

printed wire board

surface mount technology

isotopic adhesives

Författare

Markus Dernevik

Institutionen för mikroelektronik

Ämneskategorier

Elektroteknik och elektronik

ISBN

992-576032-1

Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 276