Direct 3D printed shadow mask on Silicon
Paper i proceeding, 2016

A 3D printed shadow mask method is presented. The 3D printer prints ABS plastic directly on the wafer, thus avoiding gaps between the wafer and the shadow mask, and deformation during the process. The wafer together with the 3D printed shadow mask was sputtered with Ti and Au. The shadow mask was released by immersion in acetone. The sputtered patches through the shadow mask were compared to the opening of the 3D printed shadow mask and the design dimensions. The patterned Au patches were larger than the printed apertures, however they were smaller than the design widths. The mask was printed in 4 min, the cost is less than one euro cent, and the process is a low temperature process suitable for temperature sensitive components.


Sofia Rahiminejad

Elektronikmaterial och system

Elof Köhler

Elektronikmaterial och system

Peter Enoksson

Elektronikmaterial och system

Journal of Physics: Conference Series

1742-6588 (ISSN)

Vol. 757