Power monitoring, Fourier transforms of power, and electron microscopy in evaluating the performance of abrasives in grinding
Artikel i vetenskaplig tidskrift, 2016

The use of electron microscopy and power-monitoring during grinding was investigated in terms of evaluating the fracture and wear characteristics and chip-formation mechanisms of abrasive grains and bond formulations. Diamond abrasives and fused, sintered and sintered triangular-shaped aluminium-oxide abrasives were evaluated. Power was shown to be a useful tool in determining the chip-formation mechanisms and the extent of grit fracture, particularly in triangular-shaped abrasive. Conclusions were supported by electron-microscope analysis. Power was also used to evaluate low-cost diamond vs. premium diamond abrasives. Practical recommendations are given for evaluating grit, wheel and bond performance both in the laboratory and in production.

Abrasives

Electron microscopy

Chip-formation

Sintered abrasive

Fracture

Engineered-shape abrasive

Författare

J. Badger

International Grinding Institute

Grinding Doc Consulting

R. Drazumeric

Univerza V Ljubljani

International Grinding Institute

Peter Krajnik

Chalmers, Material- och tillverkningsteknik, Tillverkningsteknik

International Journal of Abrasive Technology

1752-2641 (ISSN) 1752-265X (eISSN)

Vol. 7 4 270-283

Ämneskategorier

Produktionsteknik, arbetsvetenskap och ergonomi

Styrkeområden

Produktion

DOI

10.1504/IJAT.2016.081338