Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Artikel i vetenskaplig tidskrift, 2017

Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 degrees C to + 125 degrees C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.


Behnam Khorramdel

Jessica Liljeholm

Mika-Matti Laurila

Toni Lammi

Gustaf Mårtensson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Thorbjoern Ebefors

Frank Niklaus

Matti Maentysalo


2055-7434 (ISSN)

Vol. 3 Article no. UNSP 17002 -





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