Process optimization of preparing CMOS backplane for ultrahigh pixel density red Micro-LED display
Artikel i vetenskaplig tidskrift, 2024
CMOS
the etched PV aperture
red Micro-LED
photoresist stripping of the lift-off lithography
bonding
Författare
Xue-Yan Wang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Cheng-Long Guo
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Yi-Jian Zhou
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Xue-Qi Zhu
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Zhi-Bing Yan
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Yang Li
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Tian-Xi Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Jie Sun
Chalmers, Mikroteknologi och nanovetenskap, Kvantkomponentfysik
Qun Yan
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
ENGINEERING RESEARCH EXPRESS
2631-8695 (ISSN)
Vol. 6 4 045310Ämneskategorier
Annan materialteknik
Annan elektroteknik och elektronik
DOI
10.1088/2631-8695/ad8065