2822 PPI active matrix micro-LED display fabricated via Au-Au micro-bump bonding technology
Artikel i vetenskaplig tidskrift, 2025
Au-Au micro-bump
Micro-LED
Flip-chip bonding
Narrow pitch
Författare
Tianxi Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Jie Sun
Chalmers, Mikroteknologi och nanovetenskap, Kvantkomponentfysik
Fuzhou University
Yijian Zhou
Fuzhou University
Yuchen Lu
Fuzhou University
Jin Li
Fuzhou University
Zhonghang Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Chang Lin
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Qun Yan
Fuzhou University
Displays
0141-9382 (ISSN)
Vol. 87 102997Ämneskategorier (SSIF 2025)
Annan elektroteknik och elektronik
Textil-, gummi- och polymermaterial
Annan materialteknik
DOI
10.1016/j.displa.2025.102997