Phase separation induced heterostructure promotes strength-ductility synergy in Cu-rich compositionally complex alloy in as-cast state
Artikel i vetenskaplig tidskrift, 2025

Dual-phase alloys (Cu-Fe alloys) exhibit excellent strength by dual-phase strengthening at the interface of harder and softer phases, at the expense of ductility. In an attempt to address this limitation in Cu-Fe alloys, a novel Cu-rich (Cu50Mn30Fe10Co10) compositionally complex alloy (all elements in at%, Cu-CCA) has been developed by merging compositionally complex alloy (CCA) design principles with classical phase separation mechanism. The as-cast Cu-CCA exhibits not only phase separation (α(f.c.c)→α1f.c.c.+α2(f.c.c)) but also possesses unprecedented strength-ductility (σUTS = 630 MPa, ε = 36 %) synergy. The occurrence of phase separation into a mixture of two f.c.c. phases is a result of intelligent alloy design whereas excellent strength-ductility synergy is facilitated primarily by hetero deformation induced (HDI) strengthening at the junctions of these separated phases during deformation. Thus, this identical phase separation in newly designed Cu-CCA overcomes the conventional strength-ductility paradigm in as-cast Cu and most of its binary/ternary alloys thereby making it a profound candidate for structural applications.

Hetero-deformation induced strengthening

Compositionally complex alloys

Phase separation

Strength-ductility synergy

Cu-Fe alloys

Författare

Deeksha Mishra

Indian Institute of Technology

Abhijeet Dhal

University of North Texas

Xiaolong Li

Chalmers, Industri- och materialvetenskap, Material och tillverkning

Sheng Guo

Chalmers, Industri- och materialvetenskap, Material och tillverkning

R. L. Narayan

Indian Institute of Technology

Rajiv S. Mishra

University of North Texas

Jaiveer Singh

Indian Institute of Technology

Saurabh Nene

Indian Institute of Technology

Materials Today Communications

23524928 (eISSN)

Vol. 44 112020

Ämneskategorier (SSIF 2025)

Metallurgi och metalliska material

Annan materialteknik

DOI

10.1016/j.mtcomm.2025.112020

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Senast uppdaterat

2025-03-21