Overview of Low-Loss Transitions and PMC Packaging for RF Electronics and Multilayer Antenna for Millimeter Wave Bands

Paper i proceeding, 2026

The paper presents an overview of different low-loss transitions from classical microstrip lines to 3D metal-gap waveguide structures, suitable for compact integration and multilayer geometry. The PMC base packaging concept introduced in early 2010 serves as a key enabler for the development of low-loss transitions across various mmWave frequency bands. Both passive transitions and active circuit integration have been demonstrated to date, achieving excellent RF performance across a wide operational bandwidth at various bands.