Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni
Journal article, 2010
thermal stability
in-situ TEM
Nickel
electrodeposition
texture development
EBSD
Author
Uta Klement
Chalmers, Materials and Manufacturing Technology, Surface and Microstructure Engineering
Lutz Hollang
Suhash Dey
Manjusha Battabyal
Chalmers, Materials and Manufacturing Technology, Surface and Microstructure Engineering
Oleg Mishin
Werner Skrotzki
Diffusion and Defect Data Pt.B: Solid State Phenomena
1012-0394 (ISSN)
Vol. 160 235-240Subject Categories
Other Materials Engineering
DOI
10.4028/www.scientific.net/SSP.160.235