Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni
Artikel i vetenskaplig tidskrift, 2010

Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth upon annealing and where twinning was found to be responsible for the texture development.

thermal stability

in-situ TEM

Nickel

electrodeposition

texture development

EBSD

Författare

Uta Klement

Chalmers, Material- och tillverkningsteknik, Yt- och mikrostrukturteknik

Lutz Hollang

Suhash Dey

Manjusha Battabyal

Chalmers, Material- och tillverkningsteknik, Yt- och mikrostrukturteknik

Oleg Mishin

Werner Skrotzki

Diffusion and Defect Data Pt.B: Solid State Phenomena

1012-0394 (ISSN)

Vol. 160 235-240

Ämneskategorier

Annan materialteknik

DOI

10.4028/www.scientific.net/SSP.160.235