Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method

Stefan Bengtsson; Olof Engström

Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method
Journal article, 1990

Author

Stefan Bengtsson

Department of Solid State Electronics

Other publications Research

Olof Engström

Department of Solid State Electronics

Other publications Research

Journal Of The Electrochemical Society

Vol. 137 7 2297-2303

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/8/2017

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Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method Journal article, 1990