Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method

Stefan Bengtsson; Olof Engström

Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method
Journal article, 1990

Author

Stefan Bengtsson

Department of Solid State Electronics

Other publications Research

Olof Engström

Department of Solid State Electronics

Other publications Research

Published in

Journal Of The Electrochemical Society

Vol. 137 Issue 7 p. 2297-2303

Categorizing

Subject Categories (SSIF 2011)

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017

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Low-Temperature Preparation Of Silicon Silicon Interfaces By The Silicon-To-Silicon Direct Bonding Method Journal article, 1990