The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding

Stefan Bengtsson; Karin Ljungberg; Jan Vedde

The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding
Journal article, 1996

Author

Stefan Bengtsson

Department of Solid State Electronics

Other publications Research

Karin Ljungberg

Jan Vedde

Applied Physics Letters

Vol. 69 22 3381-3383

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017

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The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding Journal article, 1996