Modification of silicon surfaces with H2SO4:H2O2:HF and HNO3:HF for wafer bonding applications
Journal article, 1996

Author

Karin Ljungberg

Ulf Jansson

Stefan Bengtsson

Department of Solid State Electronics

Anders Soderbarg

Journal Of The Electrochemical Society

Vol. 143 5 1709-1714

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017