Dynamic Recrystallization During High-Strain-Rate Tension of Copper
Journal article, 2016

Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which is subjected to uniaxial tensile strains of ~5 and strain rates up to 10^6 s^-1 in the extruded section. Through high-resolution transmission Kikuchi diffraction, we show that nucleation occurs through subgrain rotation and grain boundary bulging at boundaries between <001> and <111> oriented grains. The observed nuclei consist of subgrains with a size of approximately 200 to 400 nm.

Discontinuous dynamic recrystallization

Subgrain rotation

Dynamic recrystallization


High strain rates

Uniaxial tensile strain

High resolution

Dynamic tensile extrusions

Recrystallization (metallurgy)



Grain boundaries

Tensile strength


Nooshin Mortazavi Seyedeh

Chalmers, Physics, Materials Microstructure

Nicola Bonora

Universita di Cassino e del Lazio Meridionale

Andrew Ruggiero

Universita di Cassino e del Lazio Meridionale

Magnus Hörnqvist Colliander

Chalmers, Physics, Materials Microstructure

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

1073-5623 (ISSN)

Vol. 47A 6 2555-2559

Subject Categories

Other Engineering and Technologies

Other Materials Engineering


Chalmers Materials Analysis Laboratory

Areas of Advance

Materials Science



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