Dynamic Recrystallization During High-Strain-Rate Tension of Copper
Artikel i vetenskaplig tidskrift, 2016

Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which is subjected to uniaxial tensile strains of ~5 and strain rates up to 10^6 s^-1 in the extruded section. Through high-resolution transmission Kikuchi diffraction, we show that nucleation occurs through subgrain rotation and grain boundary bulging at boundaries between <001> and <111> oriented grains. The observed nuclei consist of subgrains with a size of approximately 200 to 400 nm.

Grain boundaries

Strain

Tensile strength

Discontinuous dynamic recrystallization

High resolution

Dynamic tensile extrusions

Subgrains

High strain rates

Dynamic recrystallization

Recrystallization (metallurgy)

Uniaxial tensile strain

Copper

Subgrain rotation

Författare

Nooshin Mortazavi Seyedeh

Chalmers, Fysik, Biologisk fysik

Nicola Bonora

Universita di Cassino e del Lazio Meridionale

Andrew Ruggiero

Universita di Cassino e del Lazio Meridionale

Magnus Hörnqvist Colliander

Chalmers, Fysik, Biologisk fysik

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

1073-5623 (ISSN)

Vol. 47A 6 2555-2559

Ämneskategorier

Annan teknik

Annan materialteknik

Infrastruktur

Chalmers materialanalyslaboratorium

Styrkeområden

Materialvetenskap

DOI

10.1007/s11661-016-3491-x