Dynamic Recrystallization During High-Strain-Rate Tension of Copper
Artikel i vetenskaplig tidskrift, 2016
Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which is subjected to uniaxial tensile strains of ~5 and strain rates up to 10^6 s^-1 in the extruded section. Through high-resolution transmission Kikuchi diffraction, we show that nucleation occurs through subgrain rotation and grain boundary bulging at boundaries between <001> and <111> oriented grains. The observed nuclei consist of subgrains with a size of approximately 200 to 400 nm.
Discontinuous dynamic recrystallization
Subgrain rotation
Dynamic recrystallization
Strain
High strain rates
Uniaxial tensile strain
High resolution
Dynamic tensile extrusions
Recrystallization (metallurgy)
Subgrains
Copper
Grain boundaries
Tensile strength
Författare
Nooshin Mortazavi Seyedeh
Chalmers, Fysik, Materialens mikrostruktur
Nicola Bonora
Universita di Cassino e del Lazio Meridionale
Andrew Ruggiero
Universita di Cassino e del Lazio Meridionale
Magnus Hörnqvist Colliander
Chalmers, Fysik, Materialens mikrostruktur
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
1073-5623 (ISSN)
Vol. 47 6 2555-2559Ämneskategorier
Annan teknik
Annan materialteknik
Infrastruktur
Chalmers materialanalyslaboratorium
Styrkeområden
Materialvetenskap
DOI
10.1007/s11661-016-3491-x