Polymer based 140 GHz Planar Gap Waveguide Array Antenna for Line of Sight (LOS) MIMO Backhaul Links
Paper in proceedings, 2019

This paper presents the micromachining based fabrication process of a 140 GHz planar antenna array based on gap waveguide technology to be used in next generation backhauling links. Each antenna element in the bigger 3D-array to be used in LOS MIMO configuration designed to have about 30dBi gain. Each antenna element in the big array consists of several metal layers such as the cavity backed radiation layer and a corporate feed network layer. In this work, we focus on the single antenna array element. Considering some fabrication difficulties as well as focusing on batch fabrication, three different micromachine techniques, SU8 fabrication, PDMS molding and injection molding of polymer OSTEMER has been utilized to fabricate the single antenna device.

SU8

LOS MIMO

PDMS

planar antenna

injection molding

Author

Sadia Farjana

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Sofia Rahiminejad

Jet Propulsion Laboratory, California Institute of Technology

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Ashraf Uz Zaman

Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas

J. Hansson

Mercene Labs AB

Mohammadamir Ghaderi

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

S. Haasl

RISE Research Institutes of Sweden

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

IMWS-AMP 2019 - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications

Vol. July 2918 148-150 8880101

5th IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2019
Bochum, Germany,

122 GHz Miniaturized High-Resolution Radar Sensor for IoT and Autonomous System Applications

VINNOVA, 2018-09-04 -- 2020-08-31.

Subject Categories

Telecommunications

Communication Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/IMWS-AMP.2019.8880101

More information

Latest update

12/6/2019