Polymer based 140 GHz Planar Gap Waveguide Array Antenna for Line of Sight (LOS) MIMO Backhaul Links
Paper i proceeding, 2019

This paper presents the micromachining based fabrication process of a 140 GHz planar antenna array based on gap waveguide technology to be used in next generation backhauling links. Each antenna element in the bigger 3D-array to be used in LOS MIMO configuration designed to have about 30dBi gain. Each antenna element in the big array consists of several metal layers such as the cavity backed radiation layer and a corporate feed network layer. In this work, we focus on the single antenna array element. Considering some fabrication difficulties as well as focusing on batch fabrication, three different micromachine techniques, SU8 fabrication, PDMS molding and injection molding of polymer OSTEMER has been utilized to fabricate the single antenna device.

SU8

LOS MIMO

PDMS

planar antenna

injection molding

Författare

Sadia Farjana

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Sofia Rahiminejad

Jet Propulsion Laboratory, California Institute of Technology

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Ashraf Uz Zaman

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

J. Hansson

Mercene Labs AB

Mohammadamir Ghaderi

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

S. Haasl

RISE Research Institutes of Sweden

Peter Enoksson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

IMWS-AMP 2019 - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications

Vol. July 2918 148-150 8880101

5th IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2019
Bochum, Germany,

122 GHz Miniatyreserad Hög-resolution Radarsensor for tillämpningar inom IoT och Autonoma System

VINNOVA, 2018-09-04 -- 2020-08-31.

Ämneskategorier

Telekommunikation

Kommunikationssystem

Annan elektroteknik och elektronik

DOI

10.1109/IMWS-AMP.2019.8880101

Mer information

Senast uppdaterat

2019-12-06