Polymer based 140 GHz Planar Gap Waveguide Array Antenna for Line of Sight (LOS) MIMO Backhaul Links
Paper i proceeding, 2019
This paper presents the micromachining based fabrication process of a 140 GHz planar antenna array based on gap waveguide technology to be used in next generation backhauling links. Each antenna element in the bigger 3D-array to be used in LOS MIMO configuration designed to have about 30dBi gain. Each antenna element in the big array consists of several metal layers such as the cavity backed radiation layer and a corporate feed network layer. In this work, we focus on the single antenna array element. Considering some fabrication difficulties as well as focusing on batch fabrication, three different micromachine techniques, SU8 fabrication, PDMS molding and injection molding of polymer OSTEMER has been utilized to fabricate the single antenna device.
SU8
PDMS
planar antenna
LOS MIMO
injection molding
Författare
Sadia Farjana
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
Sofia Rahiminejad
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
Jet Propulsion Laboratory, California Institute of Technology
Ashraf Uz Zaman
Chalmers, Elektroteknik, Kommunikation, Antenner och Optiska Nätverk
J. Hansson
Mercene Labs AB
Mohammadamir Ghaderi
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
S. Haasl
RISE Research Institutes of Sweden
Peter Enoksson
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
IMWS-AMP 2019 - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications
Vol. July 2918 148-150 8880101
978-172810935-0 (ISBN)
5th IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2019
Bochum, Germany,
Bochum, Germany,
122 GHz Miniatyreserad Hög-resolution Radarsensor for tillämpningar inom IoT och Autonoma System
VINNOVA (2018-01529), 2018-09-04 -- 2020-08-31.
Ämneskategorier
Telekommunikation
Kommunikationssystem
Annan elektroteknik och elektronik
DOI
10.1109/IMWS-AMP.2019.8880101