Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid
Paper in proceedings, 2019

The integration of metallic nanoparticlcs (NPs) in nanofluids was found to enhance the thermal properties of the mixture and affect the rheological properties of the base liquid. However, due to their size and electrochemical properties, the added metallic nanoparticlcs have a limited contribution to the thermal transport and their stability hinders further development of such an approach in thermal management. We investigated in this work the effect of the presence of graphene as a coating layer of on copper nanoparticles dispersed in water as a water-based graphene coated copper nanofluid. Electronics microscopy was deployed to investigate the presence and the number of layers of graphene around the metallic nanoparticles. The observed particles were found to have a spherical morphology with a full coating of several layers. The elemental characterization of the NPs showed the presence of graphitic structure confirming the nature of the coating. The thermal properties of the fluid were estimated versus loading fraction of graphene coated nanoparticles and temperature using a hot disk method. An increase of up to 17% was recorded at a concentration of 0.1 w.% at 45deg C. Dynamic Light Scattering and zeta potential were used to investigate the electrochemical properties of the produced nanoparticles. The particles were found to present weak surface charges corresponding to a zeta potential of 6mV that promoted the segregation of the NPs. The rheological properties of the resulted fluids were investigated using viscometer. The NFs were found to have a Newtonian behaviour.

Nanofluids

Thermal conductivity and rheology of nanofluids.

Graphene coated copper nanoparticles

Author

Abdelhafid Zehri

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Andreas Nylander

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019

8951883

22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Pisa, Italy,

Subject Categories

Polymer Technologies

Materials Chemistry

Other Chemistry Topics

DOI

10.23919/EMPC44848.2019.8951883

More information

Latest update

3/16/2020