Overview of High Frequency Electronics Integration Concepts for Gap waveguide based High Gain Slot Antenna Array
Paper in proceeding, 2019

This paper presents an overview of different low-loss microstrip to waveguide transition designs suitable for integrating millimeter wave electronics to a gap waveguide based slot array. Typically, E-plane probe type of transitions are widely used at mmWave frequency range to couple RF signal from a TX/RX MMIC to the waveguide section. H-plane split-blocks are avoided due to leakage problem from tiny slits formed by imperfect metal connections. On the other hand, the traditional slot arrays are built using H-plane split blocks. This makes it very challenging to integrate electronics and other passive components such as diplexer filter directly to a high gain planar antenna array. To overcome this above mentioned problem, we propose to use low-loss H-plane transitions to integrate RF electronics with the multi-layer gap waveguide based slot array. We demonstrate a completely packaged frontend at E-band, showing the potential of the gap waveguide technology to build a very compact full-duplex wireless system.

E-plane transition

Full-duplex

Integration and packaging

Slot arrays

Gap waveguide

Author

Ashraf Uz Zaman

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Abbas Vosoogh

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Jian Yang

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019

8958272
978-153869549-4 (ISBN)

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019
Tel-Aviv, Israel,

Subject Categories

Other Physics Topics

Signal Processing

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/COMCAS44984.2019.8958272

More information

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1/3/2024 9