Overview of High Frequency Electronics Integration Concepts for Gap waveguide based High Gain Slot Antenna Array
Paper i proceeding, 2019

This paper presents an overview of different low-loss microstrip to waveguide transition designs suitable for integrating millimeter wave electronics to a gap waveguide based slot array. Typically, E-plane probe type of transitions are widely used at mmWave frequency range to couple RF signal from a TX/RX MMIC to the waveguide section. H-plane split-blocks are avoided due to leakage problem from tiny slits formed by imperfect metal connections. On the other hand, the traditional slot arrays are built using H-plane split blocks. This makes it very challenging to integrate electronics and other passive components such as diplexer filter directly to a high gain planar antenna array. To overcome this above mentioned problem, we propose to use low-loss H-plane transitions to integrate RF electronics with the multi-layer gap waveguide based slot array. We demonstrate a completely packaged frontend at E-band, showing the potential of the gap waveguide technology to build a very compact full-duplex wireless system.

E-plane transition

Full-duplex

Integration and packaging

Slot arrays

Gap waveguide

Författare

Ashraf Uz Zaman

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

Abbas Vosoogh

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

Jian Yang

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

Vessen Vassilev

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019

8958272

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2019
Tel-Aviv, Israel,

Ämneskategorier

Annan fysik

Signalbehandling

Annan elektroteknik och elektronik

DOI

10.1109/COMCAS44984.2019.8958272

Mer information

Senast uppdaterat

2020-07-29