Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications
Paper in proceeding, 2020

This paper presents a multi-physical system-level simulation workflow to characterise the performance of a heterogeneously integrated communications module for mm-wave applications. Basic principles behind modelling different parts and properties of the module are explained. The workflow combines the electromagnetic properties of a patch antenna array operating at 39 GHz with polynomial-based power amplifier (PA) models and thermal simulations of the structural heating. Effects of heating on the PA properties are also considered. The PA model is based on and compared with circuit simulations of a mm-wave transceiver chip, and the results are in good agreement. The proposed workflow can be used to describe and predict the performance of the module in different spatio-temporal use cases, and the approach also scales to larger arrays and more detailed simulation models.

Antenna array

heterogeneous integration



electrothermal model


Kimmo Rasilainen

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Koen Buisman

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Kristoffer Andersson


Christian Fager

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Proceedings - Electronic Components and Technology Conference

05695503 (ISSN)

Vol. 2020-June 1369-1375 9159195
9781728161808 (ISBN)

70th IEEE Electronic Components and Technology Conference, ECTC 2020
Orlando, USA,

Subject Categories

Applied Mechanics

Energy Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering



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