Thermal analysis of GaN/SiC-on-Si assemblies: Effect of bump pitch and thickness of SiC Layer
Paper in proceeding, 2020
Author
Kimmo Rasilainen
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
University of Oulu
Torbjurn M.J. Nilsson
University of Oulu
Saab
Johan Bremer
University of Oulu
Mattias Thorsell
University of Oulu
Christian Fager
University of Oulu
2020 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Proceedings
9420503
9781728176437 (ISBN)
Virtual, Berlin, Germany,
Compact Millimeter Wave Integration Concept for Future Wireless and Sensor Systems
VINNOVA (2017-01898), 2017-09-01 -- 2019-08-31.
Subject Categories
Energy Engineering
Other Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/THERMINIC49743.2020.9420503