Enhancing mmWave On-Chip-Antennas Using In-Package Electromagnetic Bandgap Structures
Paper in proceeding, 2021

We propose a silicon on-Chip-in-Package antenna design featuring a simulated radiation efficiency of > 70% and an S11 matching better than −10 dB in the 112–125 GHz frequency range. High radiation performance is achieved by: (i) thinning the silicon substrate down to 100 μm through wafer-level grinding; (ii) embedding the IC in-between two PCBs, one of which forms an electromagnetic bandgap structure that attenuates the EM leakage inside the silicon substrate. Furthermore, since the die-embedding concept employs the gap-waveguide packaging technology, a universal contactless waveguide interconnect is realized between the IC and the radiating gap waveguide in the package. This will also enable modular antenna designs.

on-chip antennas

Gap waveguide technology

millimeter-wave antennas

antenna-in-package

Author

Dmitrii Kruglov

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Oleg Iupikov

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Marianna Ivashina

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Rob Maaskant

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

Published in

European Microwave Conference

1527-3342 (ISSN) 1557-9581 (eISSN)

p. 885-888
978-2-87487-063-7 (ISBN)

Conference

2021 51st European Microwave Conference (EuMC)
London, United Kingdom, 2022-04-03 - 2022-04-05

Research Project(s)

MyWave - Efficient Millimetre-Wave Communications for mobile users

European Commission (EC) (EC/H2020/860023), 2019-10-01 -- 2023-09-30.

Categorizing

Areas of Advance

Information and Communication Technology

Subject Categories

Aerospace Engineering

Communication Systems

Electrical Engineering, Electronic Engineering, Information Engineering

Embedded Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

Identifiers

DOI

10.23919/EuMC50147.2022.9784298

More information

Latest update

7/15/2022