Enhancing mmWave On-Chip-Antennas Using In-Package Electromagnetic Bandgap Structures

Paper i proceeding, 2021

We propose a silicon on-Chip-in-Package antenna design featuring a simulated radiation efficiency of > 70% and an S11 matching better than −10 dB in the 112–125 GHz frequency range. High radiation performance is achieved by: (i) thinning the silicon substrate down to 100 μm through wafer-level grinding; (ii) embedding the IC in-between two PCBs, one of which forms an electromagnetic bandgap structure that attenuates the EM leakage inside the silicon substrate. Furthermore, since the die-embedding concept employs the gap-waveguide packaging technology, a universal contactless waveguide interconnect is realized between the IC and the radiating gap waveguide in the package. This will also enable modular antenna designs.