High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Journal article, 2023
fan-out wafer level packaging
Q-factor
Ku-band
resonator
VCO
Author
Mykola Chernobryvko
Fraunhofer Society
Michael P. Kaiser
Fraunhofer Society
Kavin Senthil Murugesan
Fraunhofer Society
Dan Kuylenstierna
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Julia Marie Koszegi
Fraunhofer Society
Robert Gernhardt
Fraunhofer Society
Tanja Braun
Fraunhofer Society
Ivan Ndip
Fraunhofer Society
Martin Schneider-Ramelow
Fraunhofer Society
Advancing Microelectronics
22228748 (ISSN)
Vol. 2023 Special issue EMPC 57-60GaN mm-wave Radar Components Embedded (GRACE)
European Commission (EC) (EC/H2020/821270), 2018-11-01 -- 2020-10-31.
Subject Categories (SSIF 2011)
Communication Systems
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.23919/EMPC55870.2023.10418411