Fabrication and bonding of In bumps on Micro-LED with 8 μm pixel pitch
Journal article, 2024
bonding
Micro-LED
the growth process of In bump
height-to-size ratio
Author
Bing-Xin Jiang
Fuzhou University
Hui Chen
Fuzhou University
Wen-Jing Zhang
Fuzhou University
Jin-Hua Lan
Fuzhou University
Tian-Xi Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Chang Lin
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Zhong-Hang Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Kai-Xin Zhang
Fuzhou University
Xue-Qi Zhu
Fuzhou University
Jun He
Fuzhou University
Yi-Fan Yang
Fuzhou University
Yong-Ai Zhang
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Qun Yan
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Jie Sun
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
ENGINEERING RESEARCH EXPRESS
2631-8695 (ISSN)
Vol. 6 2 025303Subject Categories
Textile, Rubber and Polymeric Materials
Other Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1088/2631-8695/ad3610