Short Term Drift in the Recovery Time of GaN HEMT Switches
Paper in proceeding, 2024

A step stress characterization method is proposed to enable the study of the gradual degradation of memory effect-induced recovery in GaN HEMT switches. This is achieved by characterizing the transition from off- to on-state over time and tracking short-term degradation in the recovery of the insertion loss for decreasing off-state voltages. The method is demonstrated on three different technologies. The results show that the degradation varies between foundry processes, illustrating the merit of the method for evaluating the impact of memory effects in GaN HEMT switch operation.

switch

Gallium nitride (GaN)

HEMT

MMIC

Author

Andreas Divinyi

Saab

Niklas Rorsman

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Niklas Billström

Saab

Mattias Thorsell

Saab

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

2024 19th European Microwave Integrated Circuits Conference, EuMIC 2024

6-9
9782874870781 (ISBN)

19th European Microwave Integrated Circuits Conference, EuMIC 2024
Paris, France,

Subject Categories

Manufacturing, Surface and Joining Technology

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.23919/EuMIC61603.2024.10732079

More information

Latest update

12/13/2024