Fabrication of micro-bump array using a photosensitive conductive polymer for the integration of micro-light-emitting diode displays
Journal article, 2024
micro-bump array
micro-light-emitting diode display
carbon black
photosensitive conductive polymer
Author
Xueqi Zhu
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Taifu Lang
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xin Lin
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xiaowei Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yujie Xie
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yang Li
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Yijian Zhou
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yifan Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Chang Lin
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Jie Sun
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
Xiongtu Zhou
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Tailiang Guo
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Qun Yan
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Journal of Micro/ Nanolithography, MEMS, and MOEMS
1932-5150 (ISSN) 1932-5134 (eISSN)
Vol. 23 4 044901Subject Categories (SSIF 2011)
Textile, Rubber and Polymeric Materials
Other Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1117/1.JMM.23.4.044901