Fabrication of micro-bump array using a photosensitive conductive polymer for the integration of micro-light-emitting diode displays
Artikel i vetenskaplig tidskrift, 2024
Background: Recently, micro-light-emitting diode (micro-LED) displays have gained significant interest from both industry and academia due to their exceptional performance. However, the integration of micro-LED with the driver substrate during the fabrication process remains a pressing issue that needs to be addressed. Aim: We plan to realize high-yield bonding of micro-LED displays by adopting new materials. Approach: We opted for a photoresist with conductive properties by incorporating carbon black as the bonding material to fabricate a micron-level bump array. Results: This method, using only photolithography, achieves a yield of 99.99% or higher in a single step. It eliminates the need for time-consuming processes such as lift-off and vaporization in the traditional metal bump preparation process. The resulting array can be directly used to establish electrical connections with the micro-LED array. After fabrication of the bump array on the thin film transistor (TFT) driver substrate, the 80x80 micro-LED array was integrated into the TFT substrate, and after baking, a device yield of over 99.9% was attained. Conclusions: This work presents a streamlined and more effective method for integrating the micro-LED and TFT driver substrate, resulting in significant reductions in both time and economic expenses associated with the production process of micro-LED displays. (c) 2024 Society of Photo-Optical Instrumentation Engineers (SPIE)
micro-bump array
micro-light-emitting diode display
carbon black
photosensitive conductive polymer
Författare
Xueqi Zhu
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Taifu Lang
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xin Lin
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xiaowei Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yujie Xie
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yang Li
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Yijian Zhou
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Yifan Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Chang Lin
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Jie Sun
Chalmers, Mikroteknologi och nanovetenskap, Kvantkomponentfysik
Xiongtu Zhou
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Tailiang Guo
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Qun Yan
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Journal of Micro/ Nanolithography, MEMS, and MOEMS
1932-5150 (ISSN) 1932-5134 (eISSN)
Vol. 23 4 044901Ämneskategorier (SSIF 2011)
Textil-, gummi- och polymermaterial
Annan materialteknik
Annan elektroteknik och elektronik
DOI
10.1117/1.JMM.23.4.044901